350 drawings

MGM Technologies is the global source for the patented Rotary Flow-Thru (RFT) technology. RFT plating is a pioneering breakthrough in the electroplating process. It is designed to change the way plating operations are managed by providing greatly increased process and scheduling control.

The MGM RFT-350XL Plater is an economical, multi-process, single-station, automated machine designed for fast, accurate bulk-process electroplating on surface-mount electronic components. What's more, it is designed to achieve the highest quality and accuracy without wasteful media.

With a footprint of 132cm x 198cm, the cost-effective RFT-350XL Plater is extremely compact. This compact size, coupled with high-volume production and reduced capital outlay, means that your equipment can easily be multiplied to meet any future through-put requirements.

100% CATHODE EFFICIENCY.
getchart

With capabilities never before available, the MGM Technologies RFT process can successfully plate SMT chip capacitors and resistors to a thickness uniformity of CV 8-15%. The RFT process can microencapsulate micro components, such as powder as small as 25 microns in size, without agglomeration or bridging. This has never been done before in a commercial process.

anodes

CLEAN & GREEN


During the plating process, the RFT-350XL catch basin shifts and changes position over a return drain, transferring to the next process completely free of "drag-out." This means that multi-step processes can be carried out without physically transferring the plating cell. Furthermore, the need for hoists and open tanks is eliminated, ensuring a clean work station. Less space, no media, and minimized waste make for an environmentally sensible system.

Elimination of wasteful media for SMT devices is just one benefit of MGM Technologies RFT Platers. The unique design of the rotating cathode ring, combined with the dynamic flow-through of electrolyte, allows a high plating rate of top quality and repeatability.

The RFT Plater's closed path circulation and enclosed-tank design means less exposure to corrosives, more recovered chemicals and significantly less rinse water consumption than with traditional drag-out methods. The overall result is greatly lowered environmental impact, not to mention enhanced safety for production personnel and reduced operating costs.

OTHER IMPORTANT CONSIDERATIONS.

photo_twowithmachine_s

Extraordinary efficiency is key. With the RFT-350XL Plater, you will more closely match your capacity or through-put requirements to capital outlay. Additionally, thanks to the machine's small footprint and cost efficiency, you will be able to incrementally grow your production as needed. Translation: Minimized capital outlay equals maximum return on assets.

Aside from cost efficiency and compact size, the RFT technology has resulted in a number of other electroplating advances. The hydrodynamics of the cell and rotating cathode allow plating speeds up to five times faster than traditional methods.

Furthermore, because work remains in one place during the entire process, electroplated solder terminations on SMT electronic components can be processed with extreme accuracy and without wasteful media, resulting in even greater cost efficiency. Plated deposits have excellent uniformity of thickness and extraordinarily high purity.

A WORD ABOUT SPEED.

photo_installtubes_s

The RFT cell has proven to be a robust chemical process capable of high amperage production with highly accurate uniformity of thickness. This allows the process engineer to balance the paradox of choosing between quality and speed, because the RFT Plater provides the best of both worlds.

The machine accomplishes cost-effective, multi-step electroplating within a unique and versatile single-station site that boasts CoV percentages of just 8-15%. The RFT's compact size enables manufacturers to literally take the technology where it's needed, allowing more flexibility in schedule management and reducing the need for expensive manufacturing space.

By providing an impressive, compact means of cost-effective mass production, the MGM Technologies RFT Plater is a true revolution in precision electroplating. You'll recover your capital investment quickly, even as you improve your vital competitive edge in the ever-changing electronics industry.

XL front - white

MGM TECHNOLOGIES' ROTARY FLOW-THRU PLATER
SPECIFICATIONS AND CAPABILITIES

RFT-350XL Process Features

  • Does not require media for plating MLCC
  • The only commercial process for the 0201 and 00105 chips
  • Sequential process in a single machine
  • 3-chemical reservoir tanks standard
  • Closed circulation of chemistry for effective fume control
  • High volume solution flow-through cell for high-speed plating
  • Large cathode contact area
  • Large work capacity: 300-1400ml (MLCC)
  • Uses all standard plating baths with either soluble or insoluble anodes
  • Plating solution is injected into anode for high performance
  • Plating speeds 5 times faster than horizontal barrel plating process
  • High-efficiency rinse (less than 25 liters per batch)
  • Excellent deposit uniformity of thickness
  • Higher purity deposit, minimum co-deposit


RFT-350XL System Features
  • Totally enclosed mechanics
  • Molded tanks and drain basin eliminates leaking for a cleaner
  • Quick release cathodes for easier operator removal
  • Touch screen controls and Automatic unload system
  • Programmable state of the art Omron PLC processor
  • Isolated anode stations for improved chemical segregation
  • Recipe management available for up to 9 different recipes
  • Host PC networking available for central control of multiple machines
  • Safety Interlocks and fully automatic or semi-auto control
  • Wide range of cathode sizes 35mm to 100mm
  • Extra large anodes standard
  • Compact footprint (132cm x 198cm)
  • CE certified unit available


XL rear, doors open - whitesm

RFT-350XL SYSTEM OVERVIEW

The MGM Technologies RFT-350XL Plater is comprised of a vertical rotating dome, a micro porous plastic ring or laser-cut slots, and a cathode contact ring at the perimeter. Work is loaded at the top of the RFT cell, then centrifugally compacted against the cathode ring for superior electrical contact as the chemical solutions are introduced into the top of the cell.

The system is operated via a user programmable logic control with touch screen interface, with fully automatic and manual modes. The MGM Technologies RFT-350XL Plater is production-proven and meets or exceeds all current performance specifications in the MLCC industry.

Protected by: U.S. Patents 5,487,824 and 5,565,079 and Foreign Patents, including Japan Patent 7-118896.